Export LG Electronics is actively deploying the advanced packaging field, and launching the development of next-generation packaging equipment--Hybrid Bonder (hybrid bonding machine), locking high-frequency wide memory stacking applications such as...
Export LG Electronics is actively deploying the advanced packaging field, and launching the development of next-generation packaging equipment--Hybrid Bonder (hybrid bonding machine), locking high-frequency wide memory stacking applications such as HBM, and engaging in technical leadership to occupy the future chip stacking market.
According to industry news, LG Electronics has started to develop Hybrid Bonder by its Manufacturing Technology Research Institute and hopes to complete the production preparation before 2028. "We are currently developing Hybrid Bonder, which is important for the future HBM process." It is understood that the company is also planning to expand its team, accelerate its development process and strengthen key technology preparations.
Hybrid Bonding is an advanced packaging method with "copper-to-Cu atomic bonding" as the core, which can eliminate traditional bumps and solder and achieve a tighter chip stack. Compared with the traditional Thermal Compression Bonding, this technology can significantly reduce packaging thickness, improve signal transmission efficiency and improve heat dissipation performance, which is particularly attractive to the increasingly multi-layered HBM3, HBM4, HBM4E architectures.
Currently, the global Hybrid Bonding market is mainly led by the Netherlands' BE Semiconductor Industries (Besi) and the American Applied Materials. However, since SK and Samsung have the leading authority on HBM manufacturing, and both companies have shown a high degree of willingness to localize equipment, if LG Electronics can show outstanding technical strength, it will have a considerable market entry opportunity.
With AI applications driving up the dependence of high-frequency, low-power memory, HBM has become the key component of high-performance computing chips. For LG Electronics, if it can successfully develop and introduce the mass production Hybrid Bonder, it is expected to reshape the competition pattern in the global advanced packaging market.
[단독] HBM 더 얇게 만든다…LG ‘꿈의 장비’ 도전 Extended reading: Breakthrough of the technical boundaries: low temperature hybrid joint and advanced packaging
