Shenmei Semiconductor, which has the technological innovation and complete product layout in the early stage of semiconductors, has been committed to deepening the fan-out panel-level packaging market in addition to providing complete solutions for...
Shenmei Semiconductor, which has the technological innovation and complete product layout in the early stage of semiconductors, has been committed to deepening the fan-out panel-level packaging market in addition to providing complete solutions for advanced crystalline packaging applications. Now, under the strategic banner of "technology differentiation", "product platformization" and "customer globalization", we have successfully deployed seven major panel products, including cleaning equipment to panel-level packaging equipment, and have devoted our efforts to multiple semiconductor key processes.
Shenmei Semiconductor was established in Silicon Valley in the United States in 1998 and officially launched on the Nasdaq (NASDAQ: ACMR) in 2017. Through the research and development of various independent patented technologies, Shengmei Semiconductors have demonstrated the strength of "technical differentiation". Under the guidance of the strategic thinking of "product platformization", they have successfully expanded their innovative products to cleaning equipment, electromechanical equipment, advanced packaging and wet etching equipment, vertical furnace tube equipment, front-end plastic display Track equipment, and isoion-enhancing and strengthening learning atmosphere deposition PECVD There are seven major panel markets including equipment and panel-level packaging equipment. According to Gartner data, Shengmei semiconductor cleaning equipment accounted for 8% of the global market in 2024, ranking fourth. Its electric equipment has a global market share of 8.2%, ranking third in the world.
Three major differential product leaders, strongly deploying the FOPLP marketUnder the global trend of generative AI and AI chips, advanced packaging has become the most popular development mainstream for the second semiconductor industry. Fanout panel packaging (FOPLP), an important branch of advanced packaging, is regarded as the star of tomorrow to take over CoWoS. Dr. Wang Xu, CEO of Shengmei Semiconductor, said: "AI technology has increasingly demanded chips, and existing semiconductor installation technology is far from meeting this demand. This has put forward new challenges to the semiconductor equipment and materials industry, and it has also brought huge development opportunities."
In order to grasp this trend, Shengmei Semiconductor first displayed the Ultra C vac-p panel-level negative pressure cleaning equipment and Ultra ECP ap-p panel-level electric bulb equipment at the SEMICON TAIWAN 2024 venue last year, and the Ultra C bev-p was released for the first time at the SEMICON TAIWAN 2024 venue. Panel-level edge etching equipment, as the three differentiated innovative products for the extremely advanced fan-out panel-level packaging market, is a representative work aimed at the three key areas of the seven major panel markets.
Shenmei Ultra C vac-p panel-level negative pressure cleaning equipment can handle panels of 510 x 515mm and 600 x 600mm sizes and panel tuning up to 10mm height. The removal of solder residues in the wafer structure through negative pressure technology can enable the cleaning liquid to reach a narrow gap, regardless of the small convex distance (less than 40 microns) or large-sized wafers to exhibit first-class cleaning efficiency. The equipment has been fully produced at the user end.
▲ Shengmei Ultra C vac-p Panel-level Advanced Packaging Bottom Cleaning Equipment (Source: Shengmei Semiconductor)
For panel-level electric galvanizing demand, Shengmei Ultra ECP ap-p equipment is compatible with organic substrates and glass substrates, and is suitable for copper galvanizing, convex galvanizing, large copper column galvanizing, and copper column/sin/silver alloy convex galvanizing. Through the independently developed global exclusive horizontal multi-yang electromechanical technology, the equipment has good uniformity (in-plane uniformity can reach 5%) and accuracy, effectively reducing cross-contamination between electromechanical fluids, becoming the best choice for both the quality, efficiency and cost of interior panel packaging, realizing the crystalline CoWoS process toward the panel CoPoS. Shengmei Ultra ECP ap-p equipment has been recognized by the industry and won the "Technology Enablement Award" award this year by the US 3D InCites Association.
▲ Shengmei Ultra ECP ap-p panel-level advanced packaging electric bulb equipment (Source: Shengmei Semiconductor)
As for Shengmei Ultra C bev-p panel-level edge etching equipment designed for edge etching and cleaning requirements for copper-related processes, its biggest feature is that it can simultaneously perform precise edge etching on the front and back of long square panels, thereby improving product yield and reliability. In addition, the device can also etch the edges of the 10mm panel. Since the product adopts a wet etching process designed for edge etching and copper and calcines removal, it can effectively avoid electric short circuits and reduce pollution risks. While maintaining the integrity of the subsequent process step, it further ensures the durability of the components, which can be regarded as a powerful tool for unique challenges for square panel substrates.
▲ Shengmei Ultra C bev-p Panel-level advanced packaging edge wet engraving equipment (Source: Shengmei semiconductor)
Create SAPS, TEBO, Tahoe iron triangles, and complete cleaning products without LumbiaWith IC miniaturization becoming a trend, this trend has also blown to the semiconductor cleaning and electricity fields. In order to respond to this strong trend, Shengmei semiconductors continue to help customers strengthen their production efficiency through independent and unique advanced cleaning and power technology and innovative products..
Driven by strong innovation and platform strategies, Shengmei has demonstrated the most complete product line layout and the most suitable solution in the semiconductor cleaning industry. All of this is based on Shengmei's world-first space-change phase shift (SAPS) and time-energy aura-sensing hole vibration (TEBO) two megaphone wave cleaning technologies. In other words, the company has since developed various series of cleaning equipment based on these two technologies.
In 2008, Shengmei Semiconductor launched the world's first high-end single-drone wafer SAPS mega-wave cleaning equipment. The yield of the single-piece cleaning process is about 1% higher than that of the non-mega-wave cleaning equipment on the market, which once again shows that the cleaning efficiency of the innovative equipment is more powerful than the traditional ultrasound cleaning process. This technology has been adopted by SK Hynix, a large-scale IC manufacturer worldwide since 2011, and has been extended from the 35nm technology stage to the advanced 10nm technology stage.
As for the world's first TEBO mega-wave cleaning device launched in 2016, it is suitable for chemical medicines and tiny particles that clean the internal structural lines of 3D ICs. Shengmei Semiconductors will combine this equipment with the Super-Economic Carbon Dioxide Drying Equipment exhibited at SEMICON CHINA 2025 this year to combine it with the best solution for 3D microstructure cleaning.
The most important target in the industry is the Tahoe single-chip trough composite cleaning equipment, which has the advantages and efficiency of integrated trough batch cleaning and single-chip cleaning, effectively saving up to more than 75% of sulfuric acid usage.
Shengmei recently announced (2025/7/31) to make a major upgrade to its Ultra C wb moisturizing cleaning equipment. This is because the traditional wet cleaning process often has high-deep width grooves and through-hole structures, which can easily cause problems such as poor uniformity and secondary deposition of by-products when etching the wet. In order to effectively solve this chronic disease, Shengmei has upgraded to make Ultra C wb equipment fully support nitrogen (N2) bubble technology. The N2 bubble technology that is patented to protect can achieve uniformity of ultra-large bubble size and space distribution density at the same time. It can be foreseen that this can improve the efficiency of chemical medicine and liquid transfer and improve the uniformity of temperature, concentration and flow rate in the moisture engraving tank, especially in 3D NAND, 3D DRAM, and 3D logic components above 500 layers, which have huge application prospects.
Currently, Shengmei's various cleaning technologies have covered more than 95% of the semiconductor cleaning process cycle, and thus provide the most suitable cleaning solutions for a variety of semiconductor processes such as logic, memory, and power components. The company also has a superior technical wall-reinforcement and leading position for the most complete cleaning product structure through three differentiated core technologies: SAPS, TEBO and Tahoe.
Multiple technologies and products add to customers to sing and enter the semiconductor marketShengmei Semiconductor has been committed to the research and development of copper interconnection technology since its establishment. It is one of the few manufacturers in the world that have mastered the core technology of horizontal electric power and have actually produced internationally. Shengmei ECP map electric hose equipment is China's first high-end copper embedded interconnect electric hose equipment with front-section production. It is also the jewel of the company's seven major board equipment. It has made significant breakthroughs in the front-section dual embedding process, advanced packaging, 3D TSV (silicon through-section) and third-generation semiconductor applications.
In addition, Shengmei semiconductors are also extremely involved in the hot process equipment, PECVD equipment and imaging equipment, one of its seven target panels. First of all, in the field of heat processing equipment, Shengmei Pin launched the Ultra Fn ALD vertical furnace equipment in 2022 and 2024, which are two configurations: hot atomic layer sedimentation and isoion-enhanced atomic layer sedimentation. Both of them have won the Qing Dynasty from Chinese semiconductor customers. In addition, ultra-high temperature oxidation thrust trap tubes (1250°C) that greatly improve slip defects and improve process efficiency, high dielectric constant atomic layer deposition furnace tubes that apply for protection technology to improve leakage rates have been taken in the laboratory test verification stage and are about to be launched to the market.
As for the Ultra Pmax PECVD equipment widely used in mature film deposition processes, it is equipped with an independent intellectual property cavity, gas distribution device and a circular bearing design, which can provide better film uniformity, smaller film stress and better particle control and improvement capabilities.
The PECVD equipment production cavity of Shengmei Semiconductor has absorbed the advantages and disadvantages of current mainstream suppliers and has comprehensive configuration (3 Chucks for one cavity), which has better adjustability and independent IP protection. In particular, the unique independent control system is integrated into the cooperation and design of the radio, and the application is made to realize the stability and uniformity of the polycrystalline deposition. Up to now, TEOS films and SiN films have been verified by customers, and have met the customer's Spec requirements in terms of film thickness stability, uniformity and particle control. With the expansion of multiple processes, Shengmi's PECVD equipment will achieve a single customer breakthrough and a good start to spend multiple processes.
In the field of film display equipment, Shengmei launched a front-end plastic film display track equipment specially applied in 300mm round process, which can be regarded as the best solution to help customers reduce defect rates, improve production capacity, and settle total holding costs (COO). The equipment supports Krypton fluoride (KrF) deep ultraviolet micro-film process of 300WPH (300 wafers per hour). The equipment adopts a independently developed vertical cross-frame, which is easier to expand to a higher capacity of 400WPH. The company independently developed multi-partition high-precision heat plates with excellent temperature uniformity. The equipment has advanced technology, which can reduce product defect rate, improve production capacity, offset user usage costs, support mainstream exposure interface, and is suitable for various microfilm processes such as i-line, KrF, ArF and ArFi..
Under the strategy of "technology differentiation", "product platformization" and "customer globalization", in 2024, the overall operating income of Shengmei semiconductors reached US$782 million, of which the highest revenue of single crystal, Tahoe and semi-key cleaning equipment reached US$579 million, accounting for 74% of the total revenue; followed by ECP (previous packaging), furnace tubes and other technologies with a revenue of US$151 million, accounting for 19.3%; as for non-ECP Advanced packaging, services and accessories revenue was USD 0.52 billion, accounting for 6.7% [1].
Due to semiconductor IC, advanced packaging and crystal circle manufacturing, Shengmei semiconductor has completed the multi-technology and product layout of seven large-block panels that should be manufactured from the previous stage to advanced packaging, and has jointly strengthened its advantages, met challenges and mastered the business.
SEMICON Taiwan 2025 International Semiconductor Exhibition Exhibition time: September 10-12, 2025 Exhibition location: 4th floor, Taipei Nangang Exhibition Hall, Taipei Living bit number: L0700 We sincerely look forward to your redemption. Reference information: [1] Shengmei Semiconductor Company 2024 Financial Report Data Extended reading: Taiwan Power CoWoS Production is in a hurry! The biggest winner of the military competition "Advanced Packaging Equipment Concept Stock" is a one-time view CoWoS, CoPoS, and CoWoP are so stupid that they can’t tell the difference. Who is the technology that the next generation should pay attention to?
