Li Changrong Chemical took advantage of the 2025 international semiconductor development today to officially launch the advanced semiconductor process moisture formula "LCY Advanced Formulations", from high-precision humidity process to hi...
Li Changrong Chemical took advantage of the 2025 international semiconductor development today to officially launch the advanced semiconductor process moisture formula "LCY Advanced Formulations", from high-precision humidity process to high-level carbon dioxide polymers and non-humid transparent polyamide, locking the tyre-electronic advanced nanoprocess to CoWos advanced packaging test.
Li Changrong Chemical General Manager Liu Wenlong said that the semiconductor process has entered a new era of extreme precision, and cleaning materials have evolved from assisted roles to a key factor affecting yield and process efficiency. AI servers are basically 3-nanometer processes, which lead to advanced packaging and material upgrades, so cleaning materials are highly related to yields.
Liu Wenlong pointed out that Li Changrong Chemical's newly launched semiconductor process moisture formula "LCY Advanced Formulations", combines the technical prospects of electronic materials, high-level process applications and customization capabilities, supports a variety of applications such as crystal cleaning and post-packaging cleaning, and has excellent performance, selection and process compatibility, effectively meeting the precision needs of advanced processes for cleaning formulas.
Li Changrong Chemical Technology Chief Yuling said that the current precise calibration is carried out based on customer process stages and new architecture needs. It is expected that through this advanced packaging solution, advanced packaging factories and crystalline factories will achieve reliability and flexibility improvement in the diversified process, fully meet the key application needs of cleaning, separation, and etching, and help advanced packaging factories and crystalline factories to meet the challenges of the next generation.
In terms of capacity layout, Yuling pointed out that Li Changrong Chemical has invested 2.1 billion yuan to create Huwei Zhongke Electronic Materials and Semiconductor Process Moisturized Formula. In 2021, it followed Taiwan's computers to go to the US factory. Originally, due to the delay of the US chip bill, the investment amount increased by nearly 3 times from US$100 million to US$280 million. It is expected that with the chip bill's finalization, the construction process will continue to cooperate with customers to accelerate.
Semiconductor research and development agency Knowledge Sourcing Intelligence reports that benefiting from advanced packaging technologies such as 3D IC, Fan-Out packaging and system-grade packaging (SiP) to boost demand for cleaner purity and precision, the market for moisture processing and distribution is growing rapidly, with an estimated growth of US$2.993 billion in 2025 to US$4.109 billion in 2030.
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