The annual global semiconductor conference SEMICON Taiwan 2025 was officially launched today. Printing Technology will present three innovative products this year, locking key challenges such as bubbles, heat dissipation and swelling in the semicond...
The annual global semiconductor conference SEMICON Taiwan 2025 was officially launched today. Printing Technology will present three innovative products this year, locking key challenges such as bubbles, heat dissipation and swelling in the semiconductor process, comprehensively improving yield and process efficiency, and focusing on the heat dissipation of AI servers. The high-reliability SMAC rack system is shipped in small quantities this year, and is expected to increase volume next year.
Hong Zhihong, chairman of Printing Technology, said that this year, the "EvoRTS vacuum high pressure and high temperature system" will be displayed, introducing a new generation of gas flow control technology, which can effectively remove the retention and bubbles of the welder during the underfill curing process, greatly shorten the cleaning time, and eliminate the steps such as water washing, drying and electrical cleaning required for traditional processes, effectively improving packaging efficiency and yield, and making it intentional to provide advanced packaging for high yield requirements.
Printing Energy Technology Director Director Chen Gongfeng shared that this year, the BMAC system designed with Burn-in and SLT test environments was launched for the heat dissipation. This year, the BMAC system can be used to meet the strict temperature control needs of high-power processors. Because BMAC combines high-pressure flow, efficient heat transmission and temperature uniform design, it can effectively suppress strong temperature fluctuations and avoid the condensation and leakage risks brought by traditional liquid cooling heat dissipation, making it the best solution for the new generation of high-power testing.
Chen Zhurong pointed out that this BMAC system is used to dissipate heat, but thinking that advanced packaging ICs need to be used to server applications, the technology will be extended, mainly through high pressure to increase the heat dissipation efficiency several times. A small amount of shipments have been shipped this year, and it is expected that the volume will continue to increase next year, and it will follow the needs of the client in time.
For the server market, Chen Zhurong pointed out that Printing demonstrates the SMAC system developed for the high-density and high-power computing heat dissipation needs of the cloud and AI era. It adopts a zero-liquid leakage design to solve the most worry-free liquid leakage in the data center, and can maintain a stable temperature for a long time, ensure that the server computing is safe and reliable, and can respond to the global data center's demand for green computing.
Chen Gongfeng emphasized that Yineng released three innovative products this time, including advanced packaging, heat dissipation testing and data center application fields to show forward-looking layout, and also respond to the urgent demand for high efficiency, high reliability and greenness of semiconductor industries with actual technical achievements. The legal person is optimistic about the performance of the industry and is expected to reach a new high.
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